Capabilities
Material Introduction
CCL - Base2013010316433677 161x105 corptop 70e0059037ca6f9ccf99222cda205add73c7bfc6725aebfa0dc4ec9e472528b5 1.Polyimide
  Structure:
TPI
PI
TPI
2.Liquid Crystal Polymer 
  (High Frequency / 
   High Speed Application)
  Structure:
LCP
3.Teflon System 
  (High Frequency / 
   High Speed Application)

RoHS
Halogen Free
CCL - Double Sided2013010316494325 161x105 corptop 6ec190036ed7a7ffaf69fe973641c40377d546a668fcb7ed3949577c931bb958 1.Thinning Trend
  (Cu ≦ 9μm;
    PI ≦ 12.5μm)
2.Thickening Trend
  (PI ≧ 50μm)
3.High Frequency /
   High Speed Application
Structure:
Cu
TPI
PI
TPI
Cu

RoHS
Halogen Free

CCL – Single Sided2013010316524572 161x105 corptop 38fa7e86f30ae0e0a692c6d11608ea2a170dfedf0394d1536fea80a21ba09855 Product Thinning (Cu ≦ 9μm;PI ≦ 12.5μm) can be used by Roll to Roll Equipments.

◎Thinning
◎Low Spring

Structure:
Cu
PI

RoHS
Halogen Free

Coverlay2012091112060138 161x105 corptop f2f3c18302a3f886c68ec7e600cd9f904b23326f2cacbbb65541780746689f37 1.Product Thinning
  (PI ≦ 7.5μm)  
2.Colorful Type of PI:
   Black, White, Yellow,
   Transparent

◎Thining
◎Low Spring

Structure:
PI
AD
Released Film

RoHS
Halogen Free
Bonding Sheet2012091114010197 161x105 corptop 82e04e29e74b874214d2ee3adc625975cbe566fffb13a88d4cbe251773dd4d4f Application for Multilayer Boards or Stiffener Adhesive.

Structure:
Released Paper
Adhesive
Released Film

RoHS 
Halogen Free
Stiffener2012091114032693 161x105 corptop 0d7c085889860400fe64c302aafe87a986e3c32f66ab9628e04ef53676580057 Sustain electronic components or strengthen
the plugging of bonding fingers.

Structure:
PI
Adhesive
PI
Adhesive
Released Film

RoHS
Halogen Free
Shielding Film2012091710250200 161x105 corptop 86da26beb5fc377365e0db2cbcda35e3a5cace5a189b23acbbb30fd5a7650c66 Prevent the interference of electromagnetic wave and increase the flexibility.

Structure:
Transfer Film (PET)
Insulation Layer
Ag Deposition Layer
Anisotropic Conduction Adhesive Layer
Protection Film (PET)

RoHS
Halogen Free
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